Chipbond Technology (6147.TWO) stock: key figures, P/E, revenue and dividend

Information Technology · Semiconductors · Taiwan · ISIN TW0006147002

Price
206.00 TWD
Market cap
153.39 bn TWD
P/E (2025)
55.27
P/S (2025)
7.15
Dividend yield
1.36 %
Net margin
12.94 %
Return on equity (ROE)
5.86 %
Return on assets (ROA)
5.12 %

Chipbond Technology financials

Fiscal year20242025
Revenue20.34 bn TWD21.45 bn TWD
Gross profit4.57 bn TWD4.59 bn TWD
Operating income2.54 bn TWD2.40 bn TWD
EBIT4.77 bn TWD3.28 bn TWD
Net income4.13 bn TWD2.78 bn TWD
Diluted EPS – continuing operations5.55 TWD3.73 TWD

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About Chipbond Technology

Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and internationally. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; test services; and die processing services, such as wafer grinding/thinning, dicing, and tape-and-reel processes, as well as chip-on-film, chip on glass, chip-on-plastic, packaging attachment, and wafer level chip scale packaging services. It also provides compound semiconductors including SiGe, GaAs, GaN, SiC, and other wafers; flexible tape-and-reel circuit substrate; and chip tray. In addition, it develops, manufactures, packages, tests, sells, and after-sale services of integrated circuit and special materials for semiconductors; invests in, develops, manufactures, and sells electronic components; and manufactures and sales elements. Chipbond Technology Corporation was incorporated in 1997 and is based in Hsinchu City, Taiwan.

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Not investment advice. All data without warranty, price as of 22.10.2026. Details in the risk notice.

Chipbond Technology stock (6147.TWO): P/E, revenue, dividend | finmetric