Winbond Electronics Corp (2344.TW) stock: key figures, P/E, revenue and dividend

Information Technology · Semiconductors · Taiwan · ISIN TW0002344009

Price
154.00 TWD
Market cap
693.00 bn TWD
P/E (2025)
175.00
P/S (2025)
7.75
Dividend yield
0.32 %
Net margin
4.43 %
Return on equity (ROE)
3.47 %
Return on assets (ROA)
2.06 %

Winbond Electronics Corp financials

Fiscal year20242025
Revenue81.61 bn TWD89.41 bn TWD
Gross profit24.00 bn TWD31.20 bn TWD
Operating income336.09 m TWD5.66 bn TWD
EBIT2.32 bn TWD6.00 bn TWD
Net income601.00 m TWD3.96 bn TWD
Diluted EPS – continuing operations0.14 TWD0.88 TWD

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About Winbond Electronics Corp

Winbond Electronics Corporation engages in the research, development, production and sales of integrated circuits, various semiconductor components and other system products. The company offers customized memory solutions, including CUBE(3DCaaS), pseudo static random access memory, DDR/SDR, LPDDR/LPSDR, Known Good Die wafer products; electrical simulation, wafer-level speed testing, and other services; redistribution layers; and failure analysis services, as well as low power SDR, DDR, DDR2, DDR3, and DDR4/4X SDRAM products. It also provides specialty DRAM products, such as SDRAM, DDR SDRAM, DDR2 SDRAM, DDR3 SDRAM, and DDR4 SDRAM products; code storage flash memory products comprising serial NOR, 1.2V serial NOR, octal NOR, QspiNAND, OctalNAND, SLC NAND, NAND based MCP, SpiStack, and authentication flash products; TrustME secure flash memory, such as secure flash memory, and secure memory elements; and logic IC products. In addition, the company is involved in the research, development, design, sale, and after-sales service of semiconductors and 6-inch wafer fab production, testing, and foundry services; E-commerce and investment business; semiconductor component design and marketing services; smart factory solutions; semiconductor-related hardware and software system integration design; design, research, testing, sales, and service of integrated circuits and auxiliary equipment; develops automotive and industrial control software and services; customer service and technical support; computer software services; computers and peripherals, and software wholesale; repair, testing, and related technical consulting services; and rental of semiconductor-related equipment. It markets its products through distributors and online. The company's products are used in computer, communication, consumer, automotive, and industrial electronics. Winbond Electronics Corporation was incorporated in 1987 and is headquartered in Taichung, Taiwan.

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Not investment advice. All data without warranty, price as of 15.10.2026. Details in the risk notice.

Winbond Electronics Corp stock (2344.TW): P/E, revenue, dividend | finmetric